Key Data of the production

CONNECTION TECHNOLOGY

Bonding

• Adhesive stencil printing
• Dispensers

Soldering

• Full-tunnel double wave soldering under nitrogen
• Reflow soldering under nitrogen
• Selective soldering under nitrogen

Stencil printing

• Stencil frames 585 x 585mm
• Print area approx. 450 x 450mm
  (other sizes only after testing)

Coating

• High speed coating, dam & fill, IR oven

Control

• Highspeed 3D-AOI

COMPONENTS

Designs

• Fitting of all conventional components
• Special designs, labels
• SMD chips from 0201
• ICs up to 55mm
• Pitch clearance up to 0.35mm
• BGA

Programming

• PROM, EPROM, EEPROM, FLASH
• PALs, GALs, EPLDs, microcontrollers
• Special component adaptor procurable upon request
• Gear and set programmers
• Programming with Sprint Optima

CIRCUIT BOARDS

Dimensions

• Min. 100 x 135mm
• Max. 450 x 450mm
• Other sizes only after testing